BindUP
BindUP predicts DNA and RNA binding proteins from protein three-dimensional structures by analyzing protein surface electrostatics and intrinsic surface properties.
Key Features:
- Non-homology-based approach: Uses electrostatic features and general protein surface properties rather than sequence homology to identify nucleic acid-binding capability.
- Electrostatic surface analysis: Evaluates electrostatic surface patches that are important for DNA and RNA interactions.
- Detection of proteins without known domains: Predicts nucleic acid-binding function in proteins lacking recognizable binding domains or similarity to established nucleic acid-binding proteins.
- Scalability and throughput: Supports single and batch processing to analyze multiple protein structures concurrently.
- Performance validation: Demonstrated high accuracy through testing on diverse datasets.
Scientific Applications:
- Identification of nucleic acid-binding proteins: Enables discovery of proteins with potential DNA- or RNA-binding functions from structural models or solved structures.
- Gene expression and regulation studies: Supports investigation of proteins involved in regulation of gene expression via nucleic acid interactions.
- Discovery of novel regulators: Facilitates finding previously unrecognized regulators that interact with DNA or RNA despite lacking canonical binding domains.
Methodology:
Computational prediction based on analysis of protein three-dimensional structures using electrostatic surface patch characterization and other intrinsic protein surface properties in a non-homology-based framework.
Topics
Details
- Tool Type:
- web application
- Operating Systems:
- Linux, Windows, Mac
- Added:
- 8/3/2017
- Last Updated:
- 11/25/2024
Operations
Publications
Paz I, Kligun E, Bengad B, Mandel-Gutfreund Y. BindUP: a web server for non-homology-based prediction of DNA and RNA binding proteins. Nucleic Acids Research. 2016;44(W1):W568-W574. doi:10.1093/nar/gkw454. PMID:27198220. PMCID:PMC4987955.
Documentation
User manual
http://bindup.technion.ac.il/manual.html